Nano-engineered surfaces for ultra high power density thermal management
Year
2009
Project team
Kripa Varanasi with HyukMin Kwon, Christopher J. Love, Adam Paxson, J. David Smith
Rapid dissipation of heat
As electronics become denser and consume higher power they generate considerable heat. This heat must be removed rapidly for the devices to function properly. The goal of this project is to develop novel surface-technology-enabled systems that can dissipate extremely high amounts of heat very rapidly. This would remove a critical bottleneck for next generation products and allow the deployment of smaller, higher power electronics systems.
LiquiGlide
Technology from this project was spun out into a startup company, LiquiGlide.
MIT spinout Arnasi begins applying LiquiGlide no-stick technology to help patients
The company that brought you no-stick toothpaste is moving into the medical space, with a lubricant for ostomy pouches and other products that could improve millions of lives.